Based on the remarkable achievements of the inaugural edition, the exhibition embarks on a new chapter of industrial innovation. To further establish a world-class platform for global collaboration and industry exchange, SICE 2027 will take place from May 27 to 29, 2027, at the Hangzhou Grand Convention and Exhibition Center. Taking "Gathering Chips in Qiantang, Connecting Intelligence Worldwide" as its theme, relying on Hangzhou's strengths in the digital economy and the robust momentum of the Yangtze River Delta's integrated circuit industry cluster, the event will bring together leading enterprises, innovators, and industry experts from across the global semiconductor value chain to strengthen collaboration and accelerate innovation.