HANGZHOU, China — Global exhibitor recruitment has officially commenced for the 2nd Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Expo 2027, which will take place from May 27 to 29, 2027, at the Hangzhou Grand Convention and Exhibition Center.

As the digital economy, artificial intelligence, new energy vehicles and advanced manufacturing continue to evolve at an unprecedented pace, semiconductors and integrated circuits have become increasingly critical to technological innovation, industrial upgrading and supply chain resilience. China’s integrated circuit industry is entering a new phase characterized by accelerated localization, closer coordination across the value chain and growing demand for advanced technologies, equipment and materials.

The Yangtze River Delta is home to one of China’s most comprehensive and concentrated integrated circuit industry clusters. Within the region, Hangzhou has established a distinctive position through its strong digital economy, extensive base of technology and application-oriented enterprises, leading universities and research institutions, and active industrial investment ecosystem.

These advantages enable Hangzhou to serve as an important connection point across chip design, wafer fabrication, packaging and testing, semiconductor equipment and materials, as well as downstream application markets.

Strong Momentum from the Inaugural Edition

The inaugural Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Expo, held in 2026, concluded with strong participation and tangible business outcomes. The event featured nearly 30,000 square metres of exhibition space and brought together 173 leading companies and research institutions from China and overseas. It also connected more than 600 key enterprises across the upstream and downstream semiconductor value chain. Approximately 30,000 professional visits were recorded during the exhibition, while the total value of prospective cooperation agreements generated at the event exceeded RMB 13.9 billion. Sixteen high-level industry forums were held concurrently, covering a broad range of topics related to semiconductor technology, industrial development and market collaboration.

By integrating exhibitions, professional forums, supply-and-demand matchmaking, industrial investment promotion and talent engagement, the inaugural event established a comprehensive industry service platform and received broad recognition from participating companies, institutions and industry professionals.

Building a Global Platform for Semiconductor Collaboration

Building on the success of its inaugural edition, the 2027 Expo will continue under the theme “Connecting the Chip Ecosystem, Enabling New Opportunities in Intelligent Manufacturing.”

Leveraging Hangzhou’s digital economy and the industrial strength of the Yangtze River Delta, the event aims to develop a high-level cooperation platform connecting international resources with China’s semiconductor market. Companies, institutions and industry professionals from across the global semiconductor value chain are invited to participate in the event and explore new opportunities for technology cooperation, market development, supply chain collaboration and industrial investment.

Focusing on Key Industry Priorities

The 2027 Expo will focus on the strategic priorities and practical needs of the semiconductor and integrated circuit industry. The event will seek to strengthen connections between upstream and downstream companies and provide an integrated platform for product and technology showcases, trade and procurement, technical exchanges, and investment and financing.

Particular emphasis will be placed on three key areas, including technology localization, supply chain security and resilience, and innovation in advanced semiconductor technologies.

Through targeted matchmaking sessions, private business meetings, corporate presentations and project roadshows, the Expo will facilitate more efficient cooperation between technology providers, manufacturers, suppliers, investors and end users.

It will also support the commercialization and industrial application of emerging semiconductor technologies and research results.

Advancing Regional and Cross-Sector Cooperation

The Expo will bring together government authorities, semiconductor companies, universities, research institutes, financial institutions and investment organizations.

Through closer collaboration among government, industry, academia, research and capital, the event will address critical industry challenges, including technological bottlenecks, shortages of highly skilled professionals, financing constraints and supply chain coordination.

The event will also contribute to deeper industrial coordination across the Yangtze River Delta and promote the development of a more connected and resilient regional semiconductor ecosystem.

Supporting Global Market Development

The 2nd Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Expo will support semiconductor companies in strengthening technological capabilities, expanding domestic and international market access, developing strategic partnerships and enhancing brand visibility.

By connecting technology, industry, capital, talent and application markets, the event aims to support the long-term development of the semiconductor industry and contribute to a more resilient, open and collaborative global integrated circuit ecosystem.

The global semiconductor community is invited to gather in Hangzhou in May 2027 to exchange insights, explore partnerships and identify new opportunities across the semiconductor value chain.