The semiconductor and integrated circuit (IC) industry is a sector characterized by strategic, fundamental, and pioneering nature, leading the way toward the future. With the acceleration of global digital transformation, it is of great significance for the semiconductor and IC industry. Zhejiang has established a complete industrial chain covering design, materials, equipment, manufacturing, and packaging and testing. It has formed a specialized industrial cluster for analog chips and power devices centered around Hangzhou, Shaoxing, Ningbo, and Jiaxing in the Hangzhou Bay area, along with a semiconductor materials-supported industrial cluster centered around Huzhou, Jinhua, Quzhou, and Lishui. As an important hub for the national IC design industry, the Hangzhou Municipal Government places great emphasis on the development of the IC. It has successively introduced a series of special policies, including the Special Policies for Further Encouraging the Accelerated Development of the IC Industry in Hangzhou, the Implementation Opinions on Promoting the High-Quality Development of the IC Industry, and the Policies on Promoting High-Quality Economic Development, covering financial subsidies, tax incentives, talent introduction, and platform development. The city aims to build itself into a core IC hub in the Yangtze River Delta region, in collaboration with Ningbo, Shaoxing and Jiaxing, jointly develop a core integrated circuit industrial cluster around the Hangzhou Bay area. By 2025, Hangzhou’s integrated circuit industry will reach a scale of 80 billion yuan, striving toward 100 billion yuan, with an annual growth target of 20%. In terms of construction of the industrial ecosystem, Hangzhou has established a complete industry chain covering chip design, basic materials, integrated circuit manufacturing, and large-scale applications, bringing together upstream and downstream enterprises to form an industry cluster centered on wafer manufacturing. Meanwhile, the city has nurtured a group of specialized and innovative small and medium-sized enterprises in areas such as design and manufacturing, compound semiconductors, core semiconductor materials, and key equipment and components, which widely applied in consumer electronics, industrial control and automotive electronics, contributed to the advancement of the industry.

    To provide more semiconductor and IC companies with an international platform that integrates product display, trade negotiation, technical exchange and investment cooperation. Under the guidance of the competent authorities, Golden Group, in collaboration with relevant administrative units, will hold the “Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition 2026” from May 14 to 16, 2026 at the Hangzhou Grand Convention and Exhibition Center. With a total planned area of 30,000 square meters, the exhibition takes “Connecting the Chip Ecosystem, Creating New Opportunities” as its theme. The exhibits covers a wide range of products and technologies, including integrated circuit design, IP, EDA, manufacturing, packaging and testing, equipment manufacturing, semiconductor materials, design services, and chip applications. It will bring together cutting-edge technologies and frontier products from the global semiconductor and integrated circuit industry, showcasing the full spectrum of innovation in the sector from chip design to integrated circuit solutions. Combined with exhibition and forums, the event will comprehensively showcase the innovative strength and development achievements of China’s semiconductor and IC industry particularly in the Yangtze River Delta region from multiple perspectives. It aims to share cutting-edge industry trends, gather together innovative talent, promote technological exchange and collaboration, foster the construction of an industrial ecosystem, and further drive the deep integration of the innovation, industrial and supply chains, which contributed to the high-quality development of China’s semiconductor and IC industry.

    During the exhibition, there are a series of activities held, including the Semiconductor and Integrated Circuit Industry Development Summit, Technology Exchange Meetings, Investment and Financing Matchmaking Meetings, Product Launches and Debuts. It will bring together top experts, corporate executives, and investment institutions to engage in in-depth discussions on development trends and key application scenarios of global semiconductor and integrated circuit. Multiple supply-and-demand matchmaking meetings covering semiconductors, integrated circuits, electronic power, electronics manufacturing, display manufacturing, as well as automotive, information and communications, and consumer electronics will serve as a major highlight of the exhibition. The matchmaking meetings take the form of face-to-face interactions between buyers and exhibitors to discuss product details and gather information, aiming to facilitate precise business cooperation among upstream and downstream enterprises in the industry chain.

IC Design / Chips and Applications: IC and related electronic product design, EDA, AI computing power chips, memory chips, automotive chips, smart home appliance chips, artificial intelligence chips, as well as products in the fields of the Internet of Things (IoT), AI, automotive electronics, smart cities, smart terminals, healthcare, etc.

IC Manufacturing: Semiconductor wafer fabrication, semiconductor packaging, and testing technologies and products, etc.

Advanced Packaging: Flip-chip, bumping, wafer-level packaging, 2.5D/3D advanced packaging (TSV and TGV), fan-out wafer-level packaging, as well as related design, materials, testing, and equipment, etc.

Wafer Equipment / Packaging and Testing Equipment: Precision equipment and semiconductor packaging equipment required for wafer processing, semiconductor testing equipment, IC testing instruments, equipment for advanced packaging processes (such as SiP and 3D packaging), and power device equipment, etc.

Compound Semiconductors and Power Devices: Compound semiconductor materials (such as GaN, SiC, etc.) and related products, including power devices, RF devices, as well as upstream equipment and materials, etc.

Semiconductor Materials: Monocrystalline silicon, wafers and silicon-based materials, polishing pads, photomasks, sputtering targets, polishing slurries, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin-film deposition materials, specialty gases, ultrapure water, molding compounds, high-performance plastics, etc.

Core Semiconductor Components: Machine vision systems, sensors, sealing rings, precision bearings, metal components, valves, silicon/SiC components, robots, quartz components, filters, RF power supplies, ceramic components, ESC electrostatic chucks, pressure gauges, pumps, MFC flow controllers, stepper motors, motion control systems, servo motors, linear modules, cleanroom drag chains, packaging molds, cooling equipment, induction heaters, etc.

AI Computing Power: AI chips, servers, switches, power supplies, liquid cooling and temperature control systems, etc.

Supporting Facilities and Services: Product support/cleanrooms, general business services/consulting, sales and services, standards, etc.

IC Design / Chips and Applications Pavilion

IC Manufacturing Pavilion

Packaging and Testing Equipment Pavilion

Core Components and Materials Pavilion

Compound Semiconductors and Power Devices Pavilion

I Computing Power Pavilion

Supporting Facilities and Services Pavilion

Provincial and Municipal Pavilions & Regional Clusters Pavilion

Focusing on the latest breakthroughs in “high-end chips” and “domestic substitution,” the event strives to provide a cutting-edge platform for showcasing industry-leading technologies.

It will attract professionals from around the world in semiconductors, IC, electronic power, electronics manufacturing, display manufacturing, as well as automotive, aerospace, healthcare, information and communications, and consumer electronics to participate in the exhibition. The event provides an efficient platform for participants to explore cutting-edge technologies, discuss collaborative strategies, jointly decode the new industrial ecosystem, and work together to build an open, collaborative, and resilient core future for the global semiconductor and IC industry.

Your timely reservation will allow us to preassign exhibit space. Requests for exhibit space will be accepted on a “first come, first served” basis.

To reserve the booth of “SICE 2026” or learn more information, please contact:

 Tel : (86-21) 6439-6190

E-mail: info@goldenexpo.com.cn